Hand-made circuit board

ABSTRACT

A hand-made circuit board includes a substrate and a medium layer disposed on a surface of the substrate to form a pattern. The medium layer has a non-conductive zone configured with a plurality of electrical blocks. The electrical blocks are discontinuously distributed in the non-conductive zone, so that the electrical blocks on at least one cross-section of the non-conductive zone are not electrically connected. In addition, the medium layer has a conductive zone configured with a plurality of electrical blocks. The electrical blocks are continuously distributed in the conductive zone, so that the electrical blocks on at least one cross-section of the conductive zone are electrically connected.

BACKGROUND Technology Field

This disclosure relates to a hand-made circuit board containingconductive zone and/or non-conductive zone.

Description of Related Art

The circuit board has a main function of providing the electricalconnections for the components disposed on the circuit board. Fordifferent requirements, the circuit board can be a product with thelight, thin, compact, soft, and/or hard properties. Generally, thecircuit board can be a single-layer board, a double-layer board, or amultilayer board. In practice, the printed circuit boards have beenwidely used in various electrical products and daily necessities, suchas computers, computer peripheral apparatuses, communication devices, orthe likes.

However, the manufacturing of the printed circuit board includes aplurality of steps, such as cutting a substrate, preparing a circuitlayout, transfer printing the circuit layout to the substrate by aphotoresist or printing method, exposure, developing and etching. Thismanufacturing needs many equipment and the acidic or alkali toxicsolution (e.g. the developing solution or the etching solution), so themanufacturing of circuit boards is not easy. Besides, according to theabove reasons, it is improper to manufacture the printed circuit boardsunder a normal environment. In general, the professional operators areneeded to operate the equipment for manufacturing the printed circuitboards in the factory or lab. In other words, the nonprofessional userscannot easily perform the above steps for manufacturing the circuitboards. In particular, for the education purpose, the students who havenever touched the circuits (e.g. young users) do not have the ability toparticipate the manufacturing of the circuit boards.

Therefore, it is desired to provide a circuit board for thenonprofessional users or young users. The users who have never touchedcircuits or circuit boards can still set the desired circuit layout bythemselves following the guidance of the medium layer of the circuitboard. This configuration can make the manufacturing of circuit boardseasier, so that the general users can also create a circuit board justlike a professional operator. Thus, the manufacturing of circuit boardsbecomes more flexible. Besides, the users can easily have fun in thepreparation of circuit layout and circuit boards. Moreover, the userscan put the manufactured circuit board on a construction assembly (e.g.a stereo tree house) for providing the sound, light and magnetfunctions. It can be applied to the education field and provide the joyof assembling and learning.

SUMMARY

In view of the foregoing, an objective of this disclosure is to providea hand-made circuit board, which has a medium layer for guiding theusers to create the desired circuit layout, conducting the circuits, andmaking the desired circuit board by themselves. This configuration canallow the users to manufacturing the circuit board easily just like aprofessional operator. Thus, the manufacturing of circuit boards becomesmore flexible, and the users can easily have fun in the preparation ofcircuit layout and circuit boards.

In order to achieve the above objective, the present disclosure providesa hand-made circuit board, which includes a substrate and a medium layerdisposed on a surface of the substrate to form a pattern. The mediumlayer has a non-conductive zone configured with a plurality ofelectrical blocks. The electrical blocks are discontinuously distributedin the non-conductive zone, so that the electrical blocks on at leastone cross-section of the non-conductive zone are not electricallyconnected.

In one embodiment, the medium layer further has a conductive zoneconfigured with a plurality of electrical blocks, and the electricalblocks are continuously distributed in the conductive zone, so that theelectrical blocks on at least one cross-section of the conductive zoneare electrically connected.

In one embodiment, the electrical blocks are conductive blocks,conductive wires, conductive sheets, conductive inks, conductive tapes,semi-conductive materials, or any combination thereof.

In one embodiment, the non-conductive zone or the conductive zone is aresistance-adjustable zone.

In one embodiment, the substrate is a wood substrate, a bamboosubstrate, a paper substrate, a cotton substrate, a high-density fibersubstrate, a resin substrate, or any combination thereof.

In one embodiment, the substrate comprises a coating layer disposed onthe surface of the substrate, and the medium layer is disposed on thecoating layer.

In one embodiment, the hand-made circuit board further includes at leastan electro-induced change element electrically connected to the mediumlayer.

In one embodiment, the electro-induced change element is alight-emitting unit, a heating unit, a sound unit, an electrochromicunit, a magnetic unit, or any combination thereof.

In one embodiment, the electro-induced change element is alight-emitting unit, and the light-emitting unit is made by hands.

In one embodiment, the light-emitting unit includes an electricalsubstrate, a light-emitting diode, and a flexible patch. The electricalsubstrate is electrically connected to the medium layer. Thelight-emitting diode is electrically connected to the electricalsubstrate. The flexible patch flatly attaches to or surrounds theelectrical substrate and the light-emitting diode, so that theelectrical substrate and the light-emitting diode are electrically andfirmly connected to each other.

In one embodiment, the electrical block includes graphite, graphene,silver, copper, gold, aluminum, tungsten, alloys thereof, or conductivemetal oxides thereof.

In one embodiment, the hand-made circuit board further includes abattery and a switch unit. The battery is disposed on the surface of thesubstrate, and one end of the battery is electrically connected to themedium layer. The switch unit is adjustably and electrically connectedbetween the battery and the medium layer.

To achieve the above objective, the disclosure also provides a hand-madecircuit board, which includes a substrate and a medium layer disposed ona surface of the substrate to form a pattern. The medium layer has aconductive zone configured with a plurality of electrical blocks. Theelectrical blocks are continuously distributed in the conductive zone,so that the electrical blocks on at least one cross-section of theconductive zone are electrically connected.

In one embodiment, the medium layer further has a non-conductive zoneconfigured with a plurality of electrical blocks, and the electricalblocks are discontinuously distributed in the non-conductive zone, sothat the electrical blocks on at least one cross-section of thenon-conductive zone are not electrically connected.

In one embodiment, the electrical blocks are conductive blocks,conductive wires, conductive sheets, conductive inks, conductive tapes,semi-conductive materials, or any combination thereof.

In one embodiment, the non-conductive zone or the conductive zone is aresistance-adjustable zone.

In one embodiment, the substrate is a wood substrate, a bamboosubstrate, a paper substrate, a cotton substrate, a high-density fibersubstrate, a resin substrate, or any combination thereof.

In one embodiment, the substrate comprises a coating layer disposed onthe surface of the substrate, and the medium layer is disposed on thecoating layer.

In one embodiment, the hand-made circuit board further includes at leastan electro-induced change element electrically connected to the mediumlayer.

In one embodiment, the electro-induced change element is alight-emitting unit, a heating unit, a sound unit, an electrochromicunit, a magnetic unit, or any combination thereof.

In one embodiment, the electro-induced change element is alight-emitting unit, and the light-emitting unit is made by hands.

In one embodiment, the light-emitting unit includes an electricalsubstrate, a light-emitting diode, and a flexible patch. The electricalsubstrate is electrically connected to the medium layer. Thelight-emitting diode is electrically connected to the electricalsubstrate. The flexible patch flatly attaches to or surrounds theelectrical substrate and the light-emitting diode, so that theelectrical substrate and the light-emitting diode are electrically andfirmly connected to each other.

In one embodiment, the electrical block includes graphite, graphene,silver, copper, gold, aluminum, tungsten, alloys thereof, or conductivemetal oxides thereof.

In one embodiment, the hand-made circuit board further includes abattery and a switch unit. The battery is disposed on the surface of thesubstrate, and one end of the battery is electrically connected to themedium layer. The switch unit is adjustably and electrically connectedbetween the battery and the medium layer.

As mentioned above, the present disclosure provides a hand-made circuitboard, which includes a substrate and a medium layer disposed on asurface of the substrate to form a pattern. The medium layer has anon-conductive zone configured with a plurality of electrical blocks.The electrical blocks are discontinuously distributed in thenon-conductive zone, so that the electrical blocks on at least onecross-section of the non-conductive zone are not electrically connected.Moreover, the medium layer has a conductive zone configured with aplurality of electrical blocks, and the electrical blocks arecontinuously distributed in the conductive zone, so that the electricalblocks on at least one cross-section of the conductive zone areelectrically connected. Based on the design of the medium layer, thegeneral users can be guided to create the desired circuit layout,conducting the circuits, and making the desired circuit board bythemselves. This configuration can allow the users to manufacturing thecircuit board easily just like a professional operator. Thus, themanufacturing of circuit boards becomes more flexible, and the users caneasily have fun in the preparation of circuit layout and circuit boards.In addition, the users can put the manufactured circuit board on aconstruction assembly (e.g. a stereo tree house) for providing thesound, light and magnet functions. It can be applied to the educationfield and provide the joy of assembling and learning.

BRIEF DESCRIPTION OF' THE DRAWINGS

The disclosure will become more fully understood from the detaileddescription and accompanying drawings, which are given for illustrationonly, and thus are not limitative of the present disclosure, andwherein:

FIG. 1A is a schematic diagram showing a hand-made circuit boardaccording to an embodiment of this disclosure;

FIG. 1B is a sectional view of the hand-made circuit board of FIG. 1Aalong the line B-B;

FIG. 1C is a schematic diagram showing an enlarged view of the sectionalarea A′ of FIG. 1B;

FIG. 1D is a schematic diagram showing an enlarged view of the area A ofthe medium layer as shown in FIG. 1A;

FIG. 1E is a schematic diagram showing the distribution of theelectrical blocks in the non-conductive zone of FIG. 1A, wherein thedistributed electrical blocks is increasing;

FIG. 1F is a partial enlarged diagram of the area A of the medium layeras shown in FIG. 1E;

FIG. 2A is a schematic diagram showing a hand-made circuit boardaccording to another embodiment of this disclosure;

FIG. 2B is a partial enlarged diagram of the area B of the medium layeras shown in FIG. 2A;

FIG. 3A is a schematic diagram showing a hand-made circuit boardaccording to another embodiment of this disclosure;

FIG. 3B is a schematic diagram showing the hand-made circuit board ofFIG.

3A, wherein the electrical substrate is disposed on a paper card; and

FIG. 4 is a schematic diagram showing that the hand-made circuit boardof the embodiment is disposed on a construction assembly.

DETAILED DESCRIPTION OF THE DISCLOSURE

The present disclosure will be apparent from the following detaileddescription, which proceeds with reference to the accompanying drawings,wherein the same references relate to the same elements.

FIG. 1A is a schematic diagram showing a hand-made circuit boardaccording to an embodiment of this disclosure. FIG. 1B is a sectionalview of the hand-made circuit board of FIG. 1A along the line B-B. FIG.1C is a schematic diagram showing an enlarged view of the sectional areaA′ of FIG. 1B. FIG. 1D is a schematic diagram showing an enlarged viewof the area A of the medium layer as shown in FIG. 1A. FIG. 1E is aschematic diagram showing the distribution of the electrical blocks inthe non-conductive zone of FIG. 1A, wherein the distributed electricalblocks is increasing. FIG. 1F is a partial enlarged diagram of the areaA of the medium layer as shown in FIG. 1E.

Referring to FIGS. 1A and 1B, the hand-made circuit board 1 includes asubstrate 11 and a medium layer 12. In addition, the hand-made circuitboard 1 further includes a battery 13, a switch unit 14, and twoelectro-induced change elements 15. To be noted, the hand-made circuitboard 1 of this embodiment can be applied in the education field. Forexample, the nonprofessional users or young users can follow theguidance of the medium layer 12 of the hand-made circuit board 1 so asto create the desired circuit layout, conduct the circuits, and make thedesired circuit board by themselves. Of course, in other embodiments,the hand-made circuit board 1 can be used in other fields (e.g. scienceand research fields), and this disclosure is not limited.

In this embodiment, the substrate 11 includes a coating layer (notshown), and the coating layer is disposed on the surface of thesubstrate 11. The medium layer 12 is disposed on the surface of thesubstrate 11 (on the coating layer). In other words, the coating layeris disposed between the substrate 11 and the medium layer 12. Differentthe substrate of the conventional printed circuit board, the substrate11 of the hand-made circuit board 1 can be, for example but not limitedto, a wood substrate, a bamboo substrate, a paper substrate, a cottonsubstrate, a high-density fiber substrate, a resin substrate, or anycombination thereof. Herein, the substrate 11 is an insulationsubstrate, which is different from the common substrate for theconventional printed circuit board including aluminum substrate, ironsubstrate, paper phenol copper laminated substrate, paper epoxy copperlaminated substrate, glass-epoxy copper laminated substrate, glasscomposite copper laminated substrate, glass-epoxy substrate orglass-phenyl resin substrate.

The medium layer 12 is disposed on the surface (or the coating layer) ofthe substrate 11 and forms a pattern. The medium layer 12 has anon-conductive zone 121 configured with a plurality of electrical blocksP (see FIG. 1C). The electrical blocks P can be conductive blocks,conductive wires, conductive sheets, conductive inks, conductive tapes,semi-conductive materials, or any combination thereof. In addition, theelectrical block P includes graphite, graphene, silver, copper, gold,aluminum, tungsten, alloys thereof, or conductive metal oxides thereof.Ideally, the electrical blocks P in the non-conductive zone 121 areoptionally the electrical blocks containing silver nano-particles, sothat the hand-made circuit board 1 can have a better electricalconductivity. In addition, the electrical blocks P can be optionallymade of another metal material or nonmetal material. For example, theelectrical blocks P can be made of a cheaper metal material, so that themanufacturing cost of the hand-made circuit board 1 can be reduced. Inaddition, the electrical blocks P can be thinner graphene conductiveblocks, so that the hand-made circuit board 1 can be thinner.

In this embodiment, the coating layer of the substrate 11 is a polymercoating layer, which can provide a better surface roughness.Accordingly, in the hand-made circuit board 1, the user can easily usethe conductive ink pen 4 to apply the conductive material on the mediumlayer 12, and the circuit characteristics of the painted circuit can bemore stable. In other words, the configuration of the polymer coatinglayer can help the conductive material (e.g. silver paste or silvernano-particles 41) of the conductive ink pen 4 to be properly attachedonto the non-conductive zone 121 of the medium layer 12. The attachedconductive material will not be lost easily, so the circuit of thehand-made circuit board 1 is more stable (see FIG. 1E). For example, thesubstrate 11 of this embodiment is a planar photo paper card having agood surface roughness. In other embodiments, the coating layer can beremoved, and the medium layer 12 is directly disposed on the substrate11.

Referring to FIG. 1A, the medium layer 12 has a pattern containing twoconsecutive rectangles. Accordingly, the electrical blocks P of themedium layer 12 are correspondingly arranged within the two consecutiverectangles. In other words, the circuit layout of the hand-made circuitboard 1 has a shape containing two consecutive rectangles. In otherembodiments, the medium layer 12 may also have other patterns, such as apolygon, concentric circles, a spiral, a star or an irregular shape. Inaddition, the irregular shape can be a pattern of an animal, a fruit, astar, or any favorite figure that can attract the attention of younguser and make the young user have fun.

In practice, the conductive material (e.g. conductive ink) can beapplied on the substrate 11 by a printing unit or a transfer printingunit so as to form a coating layer, thereby forming the medium layer 12having the electrical blocks P. In general, the conductive ink is awater-based or alcohol-based solution, which contains silvernano-particles, solvent (water or alcohol), surfactant, dispersionstabilizer and other additives. The conductive ink can be printed on themedium layer 12 to form any desired pattern by the digital ink printingor 3D printing method.

As shown in FIG. 1A, the medium layer 12 and the non-conductive zone 121formed on the substrate 11 is shown as a shallow gray area. In otherembodiments, the medium layer 12 may further include a plurality ofsub-patterns, and at least a part of the sub-patterns are not connectedwith each other. The sub-patterns can be dots, strips (see FIG. 2A),dotted lines, arrows, or mosaics. According to this design, thesub-patterns of the medium layer 12 can present a unique and attractivefigure.

As shown in FIG. 1A, the battery 13 and the switch unit 14 can form acontrol assembly for controlling to turn on/off the hand-made circuitboard 1. The battery 13 is disposed on the surface of the substrate 11,and one end of the battery 13 is electrically connected to the mediumlayer 12. The switch unit 14 is adjustably connected between the battery13 and the medium layer 12. In practice, the battery 13 can beoptionally the small-sized button cell battery for implementing thecompact hand-made circuit board 1 along with the thin substrate 11. Inaddition, the switch unit 14 can be formed by silver foil or copperfoil, and the user can fold the silver foil or copper foil to preparethe switch unit 14. Accordingly, the user can further participate themanufacturing of the hand-made circuit board 1, and have fun in themanufacturing process. After folding the silver foil or copper foil, theuser can simply press the switch unit 14 to electrically connect thebattery 13 and the medium layer 12.

Besides, the hand-made circuit board 1 further includes at least oneelectro-induced change element 15, which is disposed on the substrate 11and electrically connected to the medium layer 12. The electro-inducedchange element 15 can be a light-emitting unit, a heating unit, a soundunit, an electrochromic unit, a magnetic unit, or any combinationthereof. For example, the electro-induced change element 15 can be anLED, a heater, a speaker or buzzer, a photochromic sheet, anelectromagnet, or any combination thereof. Thus, after being switchedon, the electro-induced change element 15 can enable the hand-madecircuit board 1 to generate light, heat, sound, color change, or magnet.In this embodiment, the electro-induced change element 15 includes twolight-emitting units (e.g. LED). Herein, the two LEDs are connected tothe medium layer 12 (including two consecutive rectangles) in parallel.When the electrical blocks P have electrical conductivity after turningon the switch unit 14, the two LEDs can emit light. If the hand-madecircuit board 1 is installed in another construction assembly oreducation material, the hand-made circuit board 1 can be used as thelighting component of the construction assembly. For example, thehand-made circuit board 1 can be used as the roof of a house model, sothat the roof of the house model can emit light.

In addition, the electro-induced change element 15 can be optionallyselected based on the requirement of different education purposes. Forexample, in other embodiments, the electro-induced change element 15 canoptionally include a light-emitting unit and a sound unit (e.g. an LEDand a speaker). In this case, the hand-made circuit board 1 can outputlight and sound after turning on the switch unit 14 to conducting theelectrical blocks P. Moreover, the LEDs of different colors can beselected, so that the hand-made circuit board 1 can output the colorfullight. These designs can be applied to other construction assembly oreducation material and increase the product satisfaction.

In the application of the hand-made circuit board 1, the medium layer 12and the non-conductive zone 121 are functioned as the circuit layout ofthe hand-made circuit board 1. To be noted, the electrical blocks P inthe non-conductive zone 121 are electrically connected to conduct themedium layer 12 under a special condition only. The conducting status isrelated to the operation of the user.

As shown in FIGS. 1C and 1D, the area A′ of FIG. 1C and the area A ofFIG. 1D include a plurality of electrical blocks P. In the area A ofFIG. 1D, the electrical blocks P only occupy a less part of thenon-conductive zone 121. As shown in FIG. 1D, the electrical blocks Pare discontinuously distributed on the surface of the substrate 11 (sawshape), so that the electrical blocks P on the cross-section of thenonconductive zone 121 (along the line B-B of FIG. 1A) are notelectrically connected. To be noted, this disclosure only discusses thecross-section A of FIG. 1A and the area A′ of the cross-section alongthe line B-B of FIG. 1A, but this disclosure is not limited thereto.Similarly, the electrical blocks P in other area of the non-conductivezone 121 and the other cross-sections of FIG. 1A also have discontinuousdistribution. In other words, when the electrical blocks P on thecross-section of the non-conductive zone 121 are discontinuouslydistributed, the electrical blocks P are not electrically connected.Briefly, the electrical conductivity of the medium layer 12 is relatedto the continuous or discontinuous distribution of the electrical blocksP in the non-conductive zone 121.

In order to assign the medium layer 12 with electrical conductivity, aconductive layer can be provided on the non-conductive zone 121, so thatthe electrical blocks P in the non-conductive zone 121 can beelectrically connected. Thus, the medium layer 12 can have electricalconductivity. As shown in FIG. 1E, the user can use a conductive ink pen4 or conductive marker to draw a conductive layer on the medium layer12. Since the conductive ink pen 4 contains silver nano-particles 41 orsilver ink, the drawn conductive layer (containing the silvernano-particles 41) can link the discontinuous electrical blocks P in thenon-conductive zone 121, thereby electrically connecting thediscontinuous electrical blocks P. Accordingly, the medium layer 12 canbe provided with the desired electrical conductivity. In thisembodiment, the material of the silver nano-particles 41 is the same asthe material of the electrical blocks P.

FIG. 1F is a partial enlarged diagram of the area A of the medium layer12, which is drawn with the conductive layer by the conductive ink pen4. The distribution of the electrical blocks P in the non-conductivezone 121 as shown in FIG. 1F is obviously increased than thedistribution in FIG. 1D. Since the distribution of the electrical blocksP increases, the electrical blocks P will become the continuousdistribution in the cross-section and be electrically connected. Inbrief, after the user follows the guidance the medium layer 12 to drawthe electrical blocks P on the medium layer 12 with the conductive inkpen 4 containing the silver nano-particles 41, the electrical blocks Pon the cross-section of the non-conductive zone 121 become a continuousdistribution. Thus, the electrical blocks P can be electricallyconnected and the medium layer 12 is provided with the electricalconductivity, so that the hand-made circuit board 1 of FIG. 1E can beconducted.

Thus, the user can use the conductive ink pen 4 to draw the circuitlayout on the medium layer 12 according to the guidance of the mediumlayer 12, so that the medium layer 12 can have electrical conductivity.In addition, according to the material of the substrate 11 and thedrawing speed of the user, the user can draw circuit lines withdifferent lengths. Besides, based on the surface roughness of thesubstrate 11, the effective distance of the drawn circuit lines can bedifferent. For example, if the substrate 11 has a rough surface, thelengths of the drawn circuit lines are shorter. In this embodiment, thesubstrate 11 of the hand-made circuit board 1 is a smooth photo papercard and has a coating layer, so lengths of the drawn circuit lines arelonger. This configuration can sufficiently increase the efficiency andlifetime of the conductive ink pen 4. Moreover, on the photo paper cardas the substrate 11, the drawn wrong circuit can be erased, and theelectrical blocks P can have better electrical conductivity.

To be noted, as shown in FIGS. 1A and 1E, the medium layer 12 canfurther include a conductive zone 122, which can also be applied with acoating layer. The conductive zone 122 also includes a plurality ofelectrical blocks P, which are continuously distributed, so that theelectrical blocks P on at least one cross-section of the conductive zone122 are electrically connected. In specific, the conductive zone 122 isa low resistance zone, and the resistance value of the conductive zone122 can be optionally adjusted based on the requirement of the user. Theconfiguration of the conductive zone 122 allows the user to draw thedesired conductive layer on the medium layer 12 with the conductive inkpen 4 or conductive marker, thereby preventing the open circuit of themedium layer 12. In other embodiments, the non-conductive zone 121 is ahigh resistance zone, and the resistance value of the non-conductivezone 121 can also be optionally adjusted based on the requirement of theuser. For example, the user can repeatedly draw a circuit line with theconductive ink pen 4 or conductive marker, so that the distributiondensity of the electrical blocks P in this drawn area can be increased,thereby reducing the resistance value of the conductive zone 122. Inaddition, the user may reduce the repeated lines drawn on the mediumlayer 12, so that the conductive zone 122 can be maintained at a highresistance value. Accordingly, the user can optionally control theresistance value of the conductive zone or non-conductive zone, and theadjustment and switching between the conducting and non-conductingmodes. Moreover, the medium layer 12 of the hand-made circuit board 1may include eight one or both of the non-conductive zone 121 and theconductive zone 122, and this disclosure is not limited.

As mentioned above, the hand-made circuit board 1 of the presentdisclosure includes a substrate 11 and a medium layer 12 disposed on asurface of the substrate 11 to form a pattern. The medium layer 12 has anon-conductive zone 121 configured with a plurality of electrical blocksP. The electrical blocks P are discontinuously distributed in thenon-conductive zone 121, so that the electrical blocks P on at least onecross-section of the non-conductive zone 121 are not electricallyconnected. Moreover, the medium layer 12 has a conductive zone 122configured with a plurality of electrical blocks P, and the electricalblocks P are continuously distributed in the conductive zone 122, sothat the electrical blocks P on at least one cross-section of theconductive zone 122 are electrically connected. In addition, the coatinglayer of the substrate 11 has good surface roughness, so that the silvernano-particles 41 of the conductive ink pen 4 can be easily disposed onthe medium layer 12, and the drawn circuit pattern and the entirecircuit can be more stable. Accordingly, the general users can followingthe guidance of the medium layer 12 to create the desired circuit on themedium layer 12, so the electrical blocks P can be continuouslydistributed and electrically connected. Based on the design of themedium layer 12, the general users can be guided by the medium layer 12to create the desired circuit layout, conduct the circuits, and make thedesired circuit board by themselves. This configuration can allow theusers to manufacturing the circuit board easily just like a professionaloperator. Thus, the manufacturing of circuit boards becomes moreflexible, and the users can easily have fun in the preparation ofcircuit layout and circuit boards.

In addition, the medium layer of the hand-made circuit board 1 can havesome different aspects cooperating with the above substrate 11.

FIG. 2A is a schematic diagram showing a hand-made circuit boardaccording to another embodiment of this disclosure, and FIG. 2B is apartial enlarged diagram of the area B of the medium layer as shown inFIG. 2A.

The components and relations between the components of the hand-madecircuit board 1 a of FIG. 2A are mostly the same as those of thehand-made circuit board 1 of the previous embodiment. Similarly, thehand-made circuit board 1 a of this embodiment also has a patterncontaining two consecutive rectangles. Different from the hand-madecircuit board 1, the medium layer 12 a of the hand-made circuit board 1a includes a plurality of electrical blocks P configured as a pluralityof stripes (sub-patterns). As shown in FIG. 2B, the area B of FIG. 2Aincludes a plurality of electrical blocks P, and the electrical blocks Pare arranged as a plurality of sub-patterns including a plurality ofstripes. Accordingly, the user can follow the guidance of the mediumlayer 12 a (the stripe sub-patterns) and draw the desired circuit layouton the medium layer 12 a (painting the silver nano-particles 41 by theconductive ink pen 4). This drawing step can increase the areapercentage of the electrical blocks P in the non-conductive zone 121 a.Since the electrical blocks P has a continuous distribution on thecross-section of the non-conductive zone 121 a, they can be electricallyconnected so as to provide the medium layer 12 a with electricalconductivity.

The design of stripe sub-patterns can provide a unique style for themedium layer 12 a of the hand-made circuit board 1 a, which has a betterattraction to the users. Besides, in this embodiment, theelectro-induced change element 15 is a light-emitting unit, and theelectro-induced change element 15 a is a sound unit. For example, theelectro-induced change elements 15 and 15 a can include an LED and aspeaker. Accordingly, when the medium layer 12 a becomes electricalconductive, the hand-made circuit board 1 a can output light and sound.Thus, the construction assembly or education material containing thehand-made circuit board 1 a can improve the product satisfaction of theuser.

The other technical features of the hand-made circuit board 1 a can bereferred to the hand-made circuit board 1 of the previous embodiment, sothe detailed descriptions thereof will be omitted.

In addition, the user can made a light-emitting unit by hands andassemble the hand-made light-emitting unit to the medium layer of thehand-made circuit board of this disclosure.

FIG. 3A is a schematic diagram showing a hand-made circuit boardaccording to another embodiment of this disclosure, and FIG. 3B is aschematic diagram showing the hand-made circuit board of FIG. 3A,wherein the electrical substrate is disposed on a paper card. Referringto FIGS. 3A and 3B, the components and relations between the componentsof the hand-made circuit board 1 b of FIG. 3A are mostly the same asthose of the hand-made circuit board 1 of the previous embodiment. Inthis embodiment, the electro-induced change element is a light-emittingunit 16. Different from the above electro-induced change elements, thelight-emitting unit 16 of the hand-made circuit board 1 b is made by theuser manually.

Referring to FIG. 3A, the light-emitting unit 16 includes an electricalsubstrate 161, a light-emitting diode 162, and a flexible patch 163. Inmore specific, the electrical substrate 161 includes electrical blockssimilar to the structure of the medium layer 12. Before the user appliesthe silver nano-particles 41 of the conductive ink pen 4 or theelectrical conductive layer on the electrical substrate 161, theelectrical substrate 161 does not have the electrical conductivity. Inthis embodiment, the electrical substrate 161 can be a wood substrate, abamboo substrate, a paper substrate, a cotton substrate, a high-densityfiber substrate, a resin substrate, or any combination thereof. Theconductive material of the electrical substrate 161 is similar to thematerial of the medium layer 12, such as graphite, graphene, silver,copper, gold, aluminum, tungsten, alloys thereof, or conductive metaloxides thereof. Moreover, the electrical substrate 161 is electricallyconnected to the medium layer 12.

In addition, the light-emitting diode 162 is electrically connected tothe electrical substrate 161. The flexible patch 163 flatly attaches toor surrounds the electrical substrate 161 and the light-emitting diode162, so that the electrical substrate 161 and the light-emitting diode162 are electrically and firmly connected to each other. In thisembodiment, the flexible patch 163 is a tape for fastening theelectrical substrate 161 and the light-emitting diode 162. In otherembodiments, the flexible patch 163 can be a double-sided adhesive orsticker for fixing the electrical substrate 161 and the light-emittingdiode 162.

As shown in FIG. 3B, the electrical substrate 161 is disposed in a papercard C in advance. Two sides of the electrical substrate 161 (the papercard) are labeled with a cathode and an anode, respectively. One papercard C can be configured with a plurality of electrical substrates 161,and a dotted line is printed on the paper card C between two adjacentelectrical substrates 161. According to the above design, the user cancut the paper card C along the dotted lines to obtain one electricalsubstrate 161. In this embodiment, the paper card C is configured withfour electrical substrates 161. In other embodiments, the paper card Ccan be configured with more or less electrical substrates 161. In theprocedure for manufacturing the light-emitting unit 16 manually, theelectrical substrate 161 and the medium layer 12 of the circuit board 1b are contacted with each other, and then the light-emitting diode 162is disposed between two electrical substrates 161. The light-emittingdiode 162 is electrically connected to the two electrodes (anode andcathode) of the electrical substrate 161. Then, the flexible patch 163is provided to wrap or fix the light-emitting diode 162 on theelectrical substrate 161 and the hand-made circuit board 1 b.

To be noted, in the procedure for manufacturing the electrical substrate161 manually, the user must cut off the redundant part of the paper cardother than the desired electrical substrate 161, so that the electricalsubstrate 161 can be perfectly electrically connected with the mediumlayer 12 of the circuit board 1 b. Besides, the electrical substrate 161can also have sub-patterns similar to those of the above medium layer 12(e.g. the shallow gray area or the stripe sub-patterns). In thisembodiment, the hand-made electrical substrate 161 has sub-patterns ofshallow gray areas. Accordingly, the user can follow the guidance of theelectrical substrate 161 and the medium layer 12 and draw the desiredcircuit layout on the medium layer 12 and the electrical substrate 161.This drawing step can increase the area percentage of the electricalblocks P in the non-conductive zone 121 and the electrical substrate161. Since the electrical blocks P has a continuous distribution on thecross-section of the non-conductive zone 121, they can be electricallyconnected so as to electrically conduct the medium layer 12 with theelectrical substrate 161, thereby enabling the light-emitting unit 16 toemit light. In this embodiment, the electrical substrate 161 forenabling the light-emitting diode 162 to emit light is made by hands, sothat the user can further enjoy the procedures for assembling thelight-emitting unit 16 and operating the hand-made circuit board 1 b.

The other technical features of the hand-made circuit board 1 b can bereferred to the hand-made circuit board 1 of the previous embodiment, sothe detailed descriptions thereof will be omitted.

FIG. 4 is a schematic diagram showing that the hand-made circuit boardof the embodiment is disposed on a construction assembly 3. As shown inFIG. 4, the construction assembly 3 includes a construction member 2.For example, the hand-made circuit board 1 is disposed in theconstruction member 2 of the construction assembly 3. The constructionassembly 3 can be a model made by the user, such as a puzzle paper house(e.g. a tree house), a woody puzzle dinosaur, or a toy car. Thehand-made circuit board 1 can be installed in the construction assembly3 for functioning as a lighting unit or a sound-light unit. For example,the hand-made circuit board 1 can be arranged on the roof of theconstruction assembly 3, so that the roof of the construction assembly 3can emit light.

In summary, the present disclosure provides a hand-made circuit board,which includes a substrate and a medium layer disposed on a surface ofthe substrate to form a pattern. The medium layer has a non-conductivezone configured with a plurality of electrical blocks. The electricalblocks are discontinuously distributed in the non-conductive zone, sothat the electrical blocks on at least one cross-section of thenon-conductive zone are not electrically connected. Moreover, the mediumlayer can have a non-conductive zone and a conductive zone configuredwith a plurality of electrical blocks. The electrical blocks arecontinuously distributed in the conductive zone, so that the electricalblocks on at least one cross-section of the conductive zone areelectrically connected. Based on the design of the medium layer, thegeneral users can be guided to create the desired circuit layout,conducting the circuits, and making the desired circuit board bythemselves. This configuration can allow the users to manufacturing thecircuit board easily just like a professional operator. Thus, themanufacturing of circuit boards becomes more flexible, and the users caneasily have fun in the preparation of circuit layout and circuit boards.In addition, the users can put the manufactured circuit board on aconstruction assembly (e.g. a stereo tree house) for providing thesound, light and magnet functions. It can be applied to the educationfield and provide the joy of assembling and learning.

Although the disclosure has been described with reference to specificembodiments, this description is not meant to be construed in a limitingsense. Various modifications of the disclosed embodiments, as well asalternative embodiments, will be apparent to persons skilled in the art.It is, therefore, contemplated that the appended claims will cover allmodifications that fall within the true scope of the disclosure.

1. A hand-made circuit board, comprising: a substrate; and a mediumlayer disposed on a surface of the substrate to form a pattern, whereinthe pattern has a non-conductive user-drawing zone configured with aplurality of electrical blocks, and the electrical particle blocks arediscontinuously distributed in the non-conductive user-drawing zone, sothat the electrical particle blocks on at least one cross-section of thenon-conductive user-drawing zone are not electrically connected.
 2. Thehand-made circuit board according to claim 1, wherein the patternfurther has a conductive zone configured with a plurality of electricalparticle blocks, and the electrical particle blocks are continuouslydistributed in the conductive zone, so that the electrical particleblocks on at least one cross-section of the conductive zone areelectrically connected.
 3. The hand-made circuit board according toclaim 2, wherein the non-conductive user-drawing zone or the conductivezone is a resistance-adjustable zone.
 4. The hand-made circuit boardaccording to claim 1, wherein the electrical particle blocks areconductive blocks, conductive wires, conductive sheets, conductive inks,conductive tapes, semi-conductive materials, or any combination thereof.5. The hand-made circuit board according to claim 1, wherein thenon-conductive user-drawing zone or the conductive zone is aresistance-adjustable zone.
 6. The hand-made circuit board according toclaim 1, wherein the hand-made circuit board further comprises: at leastan electro-induced change element electrically connected to the pattern.7. The hand-made circuit board according to claim 6, wherein theelectro-induced change element is a light-emitting unit, a heating unit,a sound unit, an electrochromic unit, a magnetic unit, or anycombination thereof.
 8. The hand-made circuit board according to claim6, wherein the electro-induced change element is a light-emitting unit,and the light-emitting unit is made by hands.
 9. The hand-made circuitboard according to claim 8, wherein the light-emitting unit comprises:an electrical substrate electrically connected to the pattern; alight-emitting diode electrically connected to the electrical substrate;and a flexible patch flatly attaching to or surrounding the electricalsubstrate and the light-emitting diode so that the electrical substrateand the light-emitting diode are electrically and firmly connected toeach other. 10-11. (canceled)